Toshiba  announced the launch of what it considers a key new addition to its portfolio of solutions for the automotive market—more specifically, for the connected car, another sub-category in the Internet of Things (IoT). The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

Sample shipments started yesterday, with mass production scheduled to start in Mar, 2015.

Toshiba releases new chip for the connected car

Toshiba’s TC358791XBG chip created exclusively for use in the connected car

The new chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front, rear and surround-view cameras, digital audio, and transferring high-resolution video content to head-unit and rear-seat entertainment systems. The TC358791XBG can also seamlessly interface with and support many leading-edge automotive application processors on the market, thanks to its USB 3.0 and MIPI® CSI-2 and DSI connectivity for both audio and video, and will support Automotive Electronics Council reliability specification AEC-Q100 (Grade 3).
The TC358791XBG can help reduce both time to market and overall system bill-of-materials costs for automotive infotainment systems.

The TC358791XBG can split one video input into two pictures and can simultaneously drive two high-resolution low-voltage differential signaling (LVDS) digital displays. Examples include head units, instrument clusters, and parking aid vision systems. The chip can also send high-resolution audio and video data from the host processor to multiple displays or other electronic control units in the car, and it has a High Definition Multimedia Interface (HDMI®) 1.4 receiver interface to allow connection of HDMI®-enabled devices to the application processor.

The new chip is housed in a FBGA257 15mm x 15mm package with 0.8 mm ball pitch. Additional features include differential CVBS (composite) interfaces for analog composite video sources, support for early back-up camera view (CVBS to LVDS), and ability to relay packetized IQ audio tuner data to the host via USB.

Applications
Infotainment and Driver Assistance applications

Main Specifications

Part NumberTC358791XBG
Input InterfaceHDMI® 1.4

MIPI® CSI-2/DSI

CVBS

SPI, IQ

Output Video InterfaceMIPI® CSI-2

LVDS Dual-link, Single-link

Bi-Direction InterfaceI2S, TDM

USB3.0

RGMII

Source VoltageMIPI®: 1.2V

CORE/PLL: 1.1V

HDMI®/USB2.0 : 3.3V

RGMII : 2.5V

LVDS/USB3.0 : 1.8V

I/O: 1.8V and 3.3V

PackageFBGA257 (15mm×15mm,0.80mm pitch)

* HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
* MIPI is a registered trademark of MIPI Alliance, Inc.
* All other trademarks and trade names are properties of their respective owners.

To find out more about this chip, contact Toshiba directly at
http://toshiba.semicon-storage.com/ap-en/contact.html